Wedge bonding is done with special and specific tools as per the need. In case of aluminum, wedge bonding is done at according to the surrounding temperature using aluminum bond wire to bond to aluminum with ultrasonic power and pressure. For wedge bonding of gold, a specific wedge bond tool is required. The aluminum wedge bonding is advantageous due to its low susceptibility to contamination compared to other forms of wire bonding.
When it comes to its applications apart from semiconductors, wedge bonding is chiefly used for packaging applications where in through stitch bonding technique, not one but more number of die and bond pads are to be joined together. For all kinds of wedge bonding tools, Axend is authorized distributor for entire South East Asia region. We are always keen to provide not only the products but process solutions too.